先进封装_先进封装-solution for semicondcutor equipmen and material

CN/EN

先进封装

先进封装作为半导体封装技术的变革者，通过各种封装技术，包含Wire Bonder, Flip Chip Bonder, TC bonder, Bumping, RDL等技术，实现各种芯片异质构成和互联，以便更好的达到HPC, AI, 5G, IOT, Storge等功能。

WLCSP Solution

SiP/Flip Chip Solution

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